NGFF插槽(WiFi SSD连接器)
1.Material Specification:   
 1-1.Housing: LCP+30% G.F UL94 V-0.   
 1-2.Contact: Copper Alloy (C5210) T=0.15mm.   
 1-3.Leg: Copper Alloy (C2680) T=0.20mm.   
2.Plating Specification:   
 2-1.Contact: see P/N.   
 2-2.Leg: Matte Tin 50μ" min. overall, Nickel 50μ" min. underplated.   
3.Mechanical Performance:   
 3-1.Insertion force: 20N max.   
 3-2.Withdrawal force: 20N max.   
 3-3.Durability: 60 cycles min.   
       No electrical discontinuity greater than 1u second. shall occur;   
 3-5.Mechanical shock: 285G half sine/6 axis. no electrical discontinuity greater than 1u second shall occur;   
4.Electrical Performance:   
 4-1.Current Rating: 0.5A (per pin).   
 4-2.Voltage Rating: 50V AC (per pin).   
 4-3.LLCR: Contact 55mΩ max.(initial), 20mΩ max. change allowed (final).   
 4-4.Insulation Resistance: 5,000MΩ min. at 500V DC.   
 4-5.Dielectric withstand voltage: 300V AC/60s.   
5.IR Reflow:   
 The peak temperature on board shall be maintained for 10 seconds at 260±5°C.   
6.Operating temperature range: -40°C~85°C(without loss function).   
7.All parts RoHS and Reach compliant.   
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