Notes:
1.Material Specification:
1-1.Housing: LCP+30% G.F UL94 V-0 Black.
1-2.Contact: C5191-1/2H T=0.12mm.
1-3.Shell: C5191-1/2H T=0.30mm.
2.Plating Specification:
2-1.Contact: see P/N.
2-2.Shell: Nickel plated or Gold Flash.
3.Mechanical Performance:
3-1.Insertion force: 44.1N (4.5 kgf) max.
3-2.Withdrawal force: 4.9N~25N(0.5kgf~2.5kgf).
3-3.Durability: 5,000 cycles.
4.Electrical Performance:
4-1.Current Rating: 0.3A.
4-2.LLCR: contact: 30mΩ max.(initial), Shell: 50mΩ max.(initial).
4-3.Insulation Resistance:
Unmated: 100MΩ min. at 500V DC.
Mated: 10MΩ min. at 150V DC.
4-4.Dielectric Withstand Voltage:
150V AC/60s(mated), 250V AC/60s(unmated).
5.IR Reflow:
The peak temperature on board shall be maintained for 10 seconds at 260±5°C.
6.Operating temperature range: -35°C~105°C(without loss function).
7.RoHS and Reach compliant.