Notes:
1.Material Specification:
1-1.Housing: LCP+30% G.F UL94 V-0.
1-2.Contact: Copper Alloy (C5210) T=0.15mm.
1-3.Leg: Copper Alloy (C2680) T=0.20mm.
2.Plating Specification:
2-1.Contact: see P/N.
2-2.Leg: Matte Tin 50μ" min. overall, Nickel 50μ" min. underplated.
3.Mechanical Performance:
3-1.Insertion force: 20N max.
3-2.Withdrawal force: 20N max.
3-3.Durability: 60 cycles min.
3-4.Vibration:
No electrical discontinuity greater than 1u second. shall occur;
3-5.Mechanical shock: 285G half sine/6 axis. no electrical discontinuity greater than 1u second shall occur;
4.Electrical Performance:
4-1.Current Rating: 0.5A (per pin).
4-2.Voltage Rating: 50V AC (per pin).
4-3.LLCR: Contact 55mΩ max.(initial), 20mΩ max. change allowed (final).
4-4.Insulation Resistance: 5,000MΩ min. at 500V DC.
4-5.Dielectric withstand voltage: 300V AC/60s.
5.IR Reflow:
The peak temperature on board shall be maintained for 10 seconds at 260±5°C.
6.Operating temperature range: -40°C~85°C(without loss function).
7.All parts RoHS and Reach compliant.