Notes:
1.Material Specification
1-1.Shell(outside/inner): Stainless Steel (SUS301) T=0.20mm.
1-2.Middle Plate: Stainless Steel (SUS301) T=0.10mm.
1-3.RFI PAD: Stainless Steel (SUS301) T=0.10mm.
1-4.Housing: LCP+30%G.F. UL94-V0 Black.
1-5.Terminal: Copper Alloy (C19400) T=0.10mm.
2.Plating Specification
2-1.Contact: see P/N.
2-2.Shell: Nickel Plated.
3.Mechanical Performance
3-1.Insertion force: 5N~20N.
3-2.Withdrawal force: 8N~20N (initial). after 1000 mating cycles 6N~20N.
3-3.Durability: 10,000 cycles.
4.Electrical Performance
4-1.Current Rating: 5A.
4-2.LLCR: contact 40mΩ max.(initial).
4-3.Insulation resistance: unmated 100MΩ min.
4-4.Dielectric withstand voltage: 100V/AC.
5.IR Reflow:
The peak temperature on board shall be maintained for 10 second at 260±5°C.
6.Operating temperature range: -55°C~105°C (without loss function).
7.RoHS and Reach compliant.